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page 1 meshconnect? em357 high temp mini modules description the meshconnect ? em357 high temperature (high temp) mini modules from california eastern laboratories (cel) combine high performance rf solutions with the market's premier zigbee ? stack. available in a high output power option (+20 dbm), these modules can accommodate variable range and performance requirements. the tiny module footprint makes them suitable for a wide range of zigbee applications. the meshconnect em357 high temp mini modules are certifed and qualifed, enabling customers to accelerate time to market by greatly reducing the design and certifcation phases of development. cel's meshconnect em357 high temp mini modules (zicm357sp2-1-ht and zicm357sp2-1c-ht) are based on the ember em357 zigbee compliant soc radio ic. the ic is a single-chip solution, compliant with zigbee specifcations and ieee 802.15.4, a complete wireless solution for all zigbee applications. the ic consists of an rf transceiver with the baseband modem, a hardwired mac and an embedded 32- bit arm ? cortex ? -m3 microcontroller with internal ram (12 kb) and flash (192 kb) memory. the device provides numerous general-purpose i/o pins and peripheral functions such as timers and uarts. cel's meshconnect em357 high temp mini modules are suitable for applications such as solar and lighting controls where the temperature requirements may exceed the industrial range specs. the modules are designed and built using high temperature components to provide a robust solution without compromising performance. integrated transceiver modules for zigbee /ieee 802.15.4 ZICM357SP2-X-HT ember tm em357 transceiver based modules ? high rf performance: up to 123 db rf link budget rx sensitivity: -103 dbm ? data rate: 250 kbps ? advanced cortex-m3 processor ? advanced power management ? 16 rf channels ? industry's premier zigbee pro stack: emberznet pro? features ? mini footprint: - 0.940" x 0.655" (23.9 mm x 16.6 mm) ? antenna options 1) integrated pcb trace antenna or 2) rf port for external antenna ? supports mesh networks ? aes encryption ? fcc and ic certifcations ? rohs compliant applications ? smart energy /grid markets - thermostats - in-home displays - smart plugs ? home automation and control - energy management - security devices - hvac control ? building automation and control ? commercial and residential lighting - fixtures and control ? solar inverters and control ? general zigbee wireless sensor networking preliminary datasheet m e shc o n n ect ? em357 high temp mini modules +20 dbm -103 dbm +123 db tx: rx: link budget: ? 192 kb flash ? 12 kb sram ? 32-bit arm ? cortex?-m3 ? up to 23 gpio pins ? spi (master/slave), twi, uart ? timers, serial wire/jtag interface ? 5-channel 14-bit adc operating temperature: -40 o c to 110 o c ZICM357SP2-X-HT ic this document is subject to change without notice document no: 0011-00-07-02-000 (issue a) date published: october 9, 2013 free datasheet http:///
page 2 introduction and overview description .............................................................................................................................................................................................. 1 features .................................................................................................................................................................................................. 1 applications ............................................................................................................................................................................................ 1 ordering information ............................................................................................................................................................................. 3 module block diagram ........................................................................................................................................................................... 3 system level function transceiver ic ......................................................................................................................................................................................... 4 antenna ................................................................................................................................................................................................... 4 power amplifer ...................................................................................................................................................................................... 4 high temperature output power ........................................................................................................................................................... 5 software /firmware ................................................................................................................................................................................. 5 electrical specifcation absolute maximum ratings ................................................................................................................................................................... 6 recommended (operating condition) .................................................................................................................................................. 6 dc characteristics .................................................................................................................................................................................. 6 rf characteristics .................................................................................................................................................................................. 6 pin signal and interfaces pin signals i/o confguration ................................................................................................................................................................ 7 i/o pin assignment ................................................................................................................................................................................. 7 module dimensions ................................................................................................................................................................................ 9 module land footprint ........................................................................................................................................................................... 10 processing ......................................................................................................................................................................................... 11 agency certifcations ................................................................................................................................................................... 13 shipment, storage and handling ............................................................................................................................................. 15 quality .................................................................................................................................................................................................. 15 references ......................................................................................................................................................................................... 16 revision history .............................................................................................................................................................................. 16 table of contents em357 high temp mini modules this document is subject to change without notice document no: 0011-00-07-02-000 (issue a) free datasheet http:///
page 3 ordering information part number order number description mi n / multiple ZICM357SP2-X-HT zicm357sp2-1-ht high temperature , +20 dbm output power, pcb trace antenna; tray package 330 /330 zicm357sp2-1-ht-r high temperature , +20 dbm output power, pcb trace antenna; tape and reel package 600 /600 zicm357sp2-1c-ht high temperature, +20 dbm output power, with castellation pin for external antenna; tray package 330 /330 zicm357sp2-1c-ht-r high temperature,+20 dbm output power, with castellation pin for external antenna; tape and reel package 600 /600 note: all packages come in trays unless a part number has a "-r" designation; part numbers with the "-r" indicate a tape and reel package option. module block diagram em357 high temp mini module (ZICM357SP2-X-HT) radio micro pa lna lpf tx/rx switch castellation edge connector ember em357 24mhz xtal high temp 110 o c em357 high temp mini modules this document is subject to change without notice document no: 0011-00-07-02-000 (issue a) free datasheet http:///
page 4 transceiver ic cels meshconnect em357 high temp mini modules use the ember em357 transceiver ic. this ic incorporates the rf transceiver with the baseband modem, a hardwired mac, and an embedded arm ? cortex?-m3 microcontroller, offering an excellent low cost high performance solution for all ieee 802.15.4 /zigbee applications. for more information about the em357 ic, visit www.silabs.com . antenna cels meshconnect em357 high temp mini modules include an integrated printed circuit board (pcb) trace antenna. an optional confguration which uses a castellation pin on the module allows the user to connect an external antenna. the ZICM357SP2-X-HT has been certifed with the pcb trace antenna and a nearson half-wave dipole antenna (part number: s181ah-2450s) on a 4 inch cable using the castellation pin of the module. please refer to the document zicm357sp2-1c external antenna implementation for details describing the requirements that must be followed to take advantage of the cel certifcation. the pcb antenna employs a topology that is compact and highly effcient. to maximize range, an adequate ground plane must be provided on the host pcb. correctly positioned, the ground plane on the host pcb will contribute signifcantly to the antenna performance (it should not be directly under the module pcb antenna). the position of the module on the host board and overall design of the product enclosure contribute to antenna performance. poor design affects radiation patterns and can result in refection, diffraction and/or scattering of the transmitted signal. for optimum antenna performance, the meshconnect modules should be mounted with the pcb trace antenna overhanging the edge of the host board. to further improve performance, a ground plane should be placed on the host board under the module, up to the antenna (a minimum of 1.5" x 1.5" is recommended). the installation of an uninterrupted ground plane on a layer directly beneath the module will also allow you to run traces under this layer. cel can provide assistance with your pcb layout. the following are some design guidelines to help ensure antenna performance: ? never place the ground plane or route copper traces directly underneath the antenna portion of the module ? never place the antenna close to metallic objects ? in the overall design, ensure that wiring and other components are not placed near the antenna ? do not place the antenna in a metallic or metalized plastic enclosure ? keep plastic enclosures 1 cm or more away from the antenna in any direction under industry canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by industry canada. to reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. conformment la rglementation d'industrie canada, le prsent metteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou infrieur) approuv pour l'metteur par industrie canada. dans le but de rduire les risques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonne quivalente (p.i.r.e.) ne dpasse pas l'intensit ncessaire l'tablissement d'une communication satisfaisante. power amplifier cels meshconnect em357 high temp mini module (ZICM357SP2-X-HT) includes a power amplifer (pa). this pa delivers high effciency, high gain, and high output power (p out = +20.0 dbm typ) to provide an extended range and reliable transmission for fewer nodes in a network. for the ZICM357SP2-X-HT, power mode 2 with power setting -2 is the maximum setting allowed for fcc compliance at 25 oc. operating in power mode 3 at higher power settings may damage the pa. em357 high temp mini modules this document is subject to change without notice document no: 0011-00-07-02-000 (issue a) free datasheet http:///
page 5 high temperature output power fcc restrictions require the output power to be maintained below 21 dbm which corresponds to power setting -2 at 25 oc. for those applications requiring the maximum output power at 110 oc, the power setting can be increased up to power setting 6 when operated at elevated temperatures. one method of implementation would be to create a look- up table for power setting versus temperature which the frmware would use to control the output power. this would require the host board to implement a temperature sensing circuit and the ability of the module to have access to the temperature such as using a temperature sensing ic connected to one of the module analog inputs. software / firmware cel's meshconnect em357 high temp mini modules are ideal platforms for emberznet pro?, the industrys most deployed and feld proven zigbee compliant stack supporting the zigbee pro feature set. emberznet pro is a complete zigbee protocol software package containing all the elements required for mesh networking applications. for more information regarding the software development for this ic, visit www.silabs.com . cel provides reference software that runs multiple functions and executes various commands. the frmware allows the execution of ieee 802.15.4 communication, validation and manufacturing tests. for example, users can setup a simple zigbee point-to-point network to perform range and packet error rate (per) tests. the software can also place the module in various operating modes, which allows for setting and/or testing various parameters. the ZICM357SP2-X-HT uses the transceiver's alternate rf ports for transmitting and should use power mode 2. syste m/host boar d em357 high t emp mini module zicm357sp2-x-h t em357 ic te mp sensor radio micro adc oper ating te mper a tur e -40 o c to 110 o c em357 high temp mini modules this document is subject to change without notice document no: 0011-00-07-02-000 (issue a) free datasheet http:///
page 6 absolute maximum ratings description meshconnect em357 high temp mini module unit min max power supply voltage (v dd ) -0.3 3.6 vdc voltage on any i/ o line -0.3 v dd + 0.3 vdc rf input power C +5 dbm storage temperature range -40 125 c refow soldering temperature C 260 c note: exceeding the maximum ratings may cause permanent damage to the module or devices. recommended (operating conditions) description meshconnect em357 high temp mini module unit min typ max power supply voltage (v dd ) 2.1 3.0 3.6 vdc input frequency 2405 C 2480 mhz ambient temperature range -40 25 110 c dc characteristics (@ 25? c, vdd = 3.0 v, ZICM357SP2-X-HT tx power mode 2) description meshconnect em357 high temp mini module unit min typ max transmit current @ 25 o c, 1 9 dbm ZICM357SP2-X-HT C 150 C ma transmit current @ - 40 o c, 2 0 dbm C 160 C ma transmit current @ 110 o c, 1 9 dbm C 175 C ma receive current over temperature C 34 C ma sleep mode current C 1 C a rf characteristics (@ 25? c, vdd = 3.0 v, ZICM357SP2-X-HT tx power mode 2) description meshconnect em357 high temp mini module unit min typ max general characteristics rf frequency range ZICM357SP2-X-HT 2405 C 2480 mhz rf channels 11 C 26 C frequency error tolerance -96.2 C 96.2 khz transmitter output power @ 2 5o c (using power mode 2, power setting -2) ZICM357SP2-X-HT C 19 C dbm output power @ -4 0 oc (using power mode 2, power setting -2) C 20 C dbm output power @ 11 0o c (using power mode 2, power setting 6) C 19 C dbm minimum output power C -40 C dbm offset error vector magnitude C 5 35 % receiver sensitivity (1% per, normal mode) ZICM357SP2-X-HT C -103 -97 dbm saturation (maximum input level) -10 C C dbm note: for the ZICM357SP2-X-HT module, power mode 2 with power setting -2 is the maximum setting allowed for fcc compliance. operating in power mode 3 at higher power settings may damage the pa. em357 high temp mini modules this document is subject to change without notice document no: 0011-00-07-02-000 (issue a) free datasheet http:///
page 7 pin signals i/o port configuration cels meshconnect module has 33 edge i/o interfaces for connection to the users host board. the meshconnect module dimensions shows the layout of the 33 edge castellations. meshconnect i /o pin assignments cel meshconnect ZICM357SP2-X-HT module pin number ember em357 ic pin number name notes 1, 2, 12, 31, 33 49 ground 3 11 pc5 pc5 is not connected to a castellaton pin, but is used internally within the module as the tx_active signal 4 12 reset actve low chip reset (input) 5 13 pc6 digital i/o osc32b - 32.768 khz crystal oscillator ntx_active - inverted tx_active signal 6 14 pc7 digital i/o osc32a - 32.768 khz crystal oscillator osc32_ext - digital 32.768 khz clock input source 7 18 pa7 digital i/o tim1c4 - timer 1 channel 4 input/output reg_en - external regulator open drain output 8 19 pb3 digital i/o tim2c3 - timer 2 channel 3 input/output sc1ncts - uart cts handshake of serial controller 1 sc1sclk - spi master/slave clock of serial controller 1 9 20 pb4 digital i/o tim2c4 - timer 2 channel 4 input/output sc1nrts - uart rts handshake of serial controller 1 sc1nssel - spi slave select of serial controller 1 10 21 pa0 digital i/o tim2c1 - timer 2 channel 1 input/output sc2mosi - spi master data out/slave data in of serial controller 2 11 22 pa1 digital i/o tim2c3 - timer 2 channel 3 input/output sc2sda - twi data of serial controller 2 sc2miso - spi master data in/slave data out of serial controller 2 13 16, 23, 28, 37 v cc 14 24 pa2 digital i/o tim2c4 - timer 2 channel 4 input/output sc2scl - twi clock of serial controller 2 sc2sclk - spi master/slave clock of serial controller 2 15 25 pa3 digital i/o tim2c2 - timer 2 channel 2 input/output sc2nssel - spi slave select of serial controller 2 traceclk - synchronous cpu trace clock 16 26 pa4 digital i/o adc4 - adc input 4 pti_en - frame signal of packet trace interface (pti) tracedata2 - synchronous cpu trace data bit 2 17 27 pa5 digital i/o adc5 - adc input 5 pti_data - data signal of packet trace interface (pti) nbootmode - embedded serial bootloader actvaton out of reset tracedata3 - synchronous cpu trace data bit 3 18 29 pa6 digital i/o tim1c3 - timer 1 channel 3 input/output em357 high temp mini modules this document is subject to change without notice document no: 0011-00-07-02-000 (issue a) free datasheet http:///
page 8 meshconnect i/o pin assignments (continued) cel meshconnect ZICM357SP2-X-HT module pin number ember em357 ic pin number name notes 19 30 pb1 digital i/o sc1miso - spi slave data out of serial controller 1 sc1mosi - spi master data out of serial controller 1 sc1sda - twi data of serial controller 1 sc1txd - uart transmit data of serial controller 1 tim2c1 - timer 2 channel 1 input/output 20 31 pb2 digital i/o sc1miso - spi master data in of serial controller 1 sc1mosi - spi slave data in of serial controller 1 sc1scl - twi clock of serial controller 1 sc1rxd - uart receive data of serial controller 1 tim2c2 - timer 2 channel 2 input/output 21 32 jtck jtag clock input from debugger swclk - serial wire clock input/output with debugger 22 33 pc2 digital i/o jtd0 - jtag data out to debugger swo - serial wire output asynchronous trace output to debugger 23 34 pc3 digital i/o jtdi - jtag data in from debugger 24 35 pc4 digital i/o jtms - jtag mode select from debugger swdio - serial wire bidirectonal data to/from debugger 25 36 pb0 digital i/o vref - adc reference input/output irqa - external interrupt source a traceclk - synchronous cpu trace clock tim1clk - timer 1 external clock input tim2msk - timer 2 external clock mask input 26 38 pc1 digital i/o adc3 - adc input 3 swo - serial wire output asynchronous trace output to debugger tracedata0 - synchronous cpu trace data bit 0 27 40 pc0 digital i/o jrst - jtag reset input from debugger irqd - default external interrupt source d tracedata1 - synchronous cpu trace data bit 1 28 41 pb7 digital i/o adc2 - adc input 2 irqc - default external interrupt source c tim1c2 - timer 1 channel 2 input/output 29 42 pb6 digital i/o adc1 - adc input 1 irqb - external interrupt source b tim1c1 - timer 1 channel 1 input/output 30 43 pb5 digital i/o adc0 - adc input 0 tim2clk - timer 2 external clock input tim1msk - timer 1 external clock mask input 32 nc rf out castellaton pin for external antenna em357 high temp mini modules this document is subject to change without notice document no: 0011-00-07-02-000 (issue a) free datasheet http:///
page 9 module dimensions note: all dimensions are +/- 0.005" (0.12 mm) unless otherwise specifed. meshconnect em357 high temp mini modules. 0.655? [16.63 mm] 0.940? [23.87 mm] r6 r7 u1 r1 c7 c7b l4 l3 c11 r10 c21 c20 l5 r11 c23 c22 r8 c5b c24 c13 c6a c1 c2 r5 l6 c6b c6 l2 c14 c10 c9 r2 r9 c15 c16 r4 c17 c4a xt al1 0.062? [1.57 mm] 0.152? [3.86m m] max e m357 series arm r6 r7 u1 r1 c7 c7b l4 l3 c11 r10 c21 c20 l5 r11 c23 c22 r8 c5b c24 c13 c6a c1 c2 r5 l6 c6b c6 l2 c14 c10 c9 r2 r9 c15 c16 r4 c17 c4a xt al1 e m357 series arm 0000000000000 em300 series module zicm357sp2-x-h t pi n 1 pi n 11 pi n 22 pi n 33 em357 high temp mini modules this document is subject to change without notice document no: 0011-00-07-02-000 (issue a) free datasheet http:///
page 10 module land footprint note: refer to the antenna section in this document for layout recommendations which will yield optimal antenna performance. dimensions are shown in inches, with millimeter conversions in brackets. em357 high temp mini modules this document is subject to change without notice document no: 0011-00-07-02-000 (issue a) free datasheet http:///
page 11 processing recommended refow profle parameter values ramp up rate (from t soakmax to t peak ) 3o/sec max minimum soak temperature 150oc maximum soak temperature 200oc soak time 60-120 sec t liquidus 217oc time above t liquidus 60-150 sec t peak 250oc time within 5o of t peak 20-30 sec time from 25o to t peak 8 min max ramp down rate 6oc/sec max pb-free solder paste use of no clean soldering paste is strongly recommended, as it does not require cleaning after the soldering process. note: toooooo sffroo7prfro3ffseoriofrfpeorfp cleaning in general, cleaning the populated module is strongly discouraged. residuals under the module cannot be easily removed with any cleaning process. ? cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. the combination of soldering fux residuals and encapsulated water could lead to short circuits between neighboring pads. water could also damage any stickers or labels. ? cleaning with alcohol or a similar organic solvent will likely food soldering fux residuals into the two housings, which is not accessible for post-washing inspection. the solvent could also damage any stickers or labels. ? ultrasonic cleaning could damage the module permanently. the best approach is to consider using a no clean solder paste and eliminate the post-soldering cleaning step. optical inspection after soldering the module to the host board, consider optical inspection to check the following: ? proper alignment and centering of the module over the pads ? proper solder joints on all pads ? excessive solder or contacts to neighboring pads or vias repeating refow soldering only a single refow soldering process is encouraged for host boards. wave soldering if a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave soldering process is encouraged. hand soldering hand soldering is possible. when using a soldering iron, follow ipc recommendations (reference document ipc-7711 ). em357 high temp mini modules this document is subject to change without notice document no: 0011-00-07-02-000 (issue a) free datasheet http:///
page 12 rework the meshconnect module can be unsoldered from the host board. use of a hot air rework tool should be programmable and the solder joint and module should not exceed the maximum peak refow temperature of 250o c. caution if temperature ramps exceed the refow temperature profle, module and component damage may occur due to thermal shock. avoid overheating. warning never attempt a rework on the module itself (i.e., replacing individual components); such actions will terminate warranty coverage. additional grounding attempts to improve the module or the system grounding by soldering braids, wires or cables onto the module rf shield cover is done at the customer's own risk. the ground pins at the module perimeter should be suffcient for optimum immunity to external rf interference. em357 high temp mini modules this document is subject to change without notice document no: 0011-00-07-02-000 (issue a) free datasheet http:///
page 13 agency certifications the following part numbers are certifed as shown below: part number certifcations antenna zicm357sp2-1-ht fcc, ic pcb zicm357sp2-1c-ht fcc, ic nearson s181ah-2450s fcc compliance statement part 15.19, section 7.15 of rss-gen this device complies with part 15 of the fcc rules and with industry canada licence-exempt rss standards. operation is subject to the following two conditions: 1. this device may not cause harmful interference, and 2. this device must accept any interference received, including interference that may cause undesired operation. le prsent appareil est conforme aux cnr d'industrie canada applicables aux appareils radio exempts de licence. l'exploitation est autorise aux deux conditions suivantes: 1. l'appareil ne doit pas produire de brouillage, et 2. l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. warning (part 15.21) changes or modifcations not expressly approved by cel could void the user's authority to operate the equipment. 20 cm separation distance to comply with fcc /ic rf exposure limits for general population/uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operated in conjunction with any other antenna or transmitter . oem responsibility to the fcc and ic rules and regulations the meshconnect high temp mini module has been certifed per fcc part 15 rules and to industry canada license-exempt rss standards for integration into products without further testing or certifcation. to fulfll the fcc and ic certifcation requirements, the oem of the meshconnect module must ensure that the information provided on the meshconnect label is placed on the outside of the fnal product. the meshconnect high temp mini module is labeled with its own fcc id number and ic id number. if the fcc id and the ic id are not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. the exterior label can use wording such as the following: contains transmitter module fcc id: w7z-zicm357sp2 or contains fcc id: w7z-zicm357sp2 contains transmitter module ic: 8254a-zicm357sp2" or "contains ic: 8254a-zicm357sp2 the oem of the meshconnect high temp mini module may only use the approved antennas (pcb trace antenna and external antenna (part number: s181ah-2450s)) that have been certifed with this module. the oem of the meshconnect high temp mini module must test their fnal product confguration to comply with unintentional radiator limits before declaring fcc compliance per part 15 of the fcc rules. em357 high temp mini modules this document is subject to change without notice document no: 0011-00-07-02-000 (issue a) free datasheet http:///
page 14 ic certifcation industry canada statement the term "ic" before the certifcation/registration number only signifes that the industry canada technical specifcations were met. certifcation ic dclaration d'industrie canada le terme "ic" devant le numro de certifcation/d'enregistrement signife seulement que les spcifcations techniques industrie canada ont t respectes. section 14 of rss-210 the installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit rf feld in excess of health canada limits for the general population. consult safety code 6, obtainable from health canada's website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/radio_guide-lignes_direct-eng.php l'article 14 du cnr-210 le programme d'installation de cet quipement radio doit s'assurer que l'antenne est situe ou oriente de telle sorte qu'il ne pas mettre de champ rf au-del des limites de sant canada pour la population gnrale. consulter le code de scurit 6, disponible sur le site web de sant canada: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/radio_guide-lignes_direct-eng.php software compliance the meshconnect high temp mini modules require software restrictions to meet agency certifcation requirements. these restrictions have been implemented in the sample application included with the software development kit. if a customer is not starting with the cel software development kit, they must implement the following output power restrictions to use the fcc, ic or ce certifcations: certifcation rf channel valid tx power steps @ 25o c typical max output power zicm357sp2-1-ht fcc/ic 11 - 24 -43 to -2 20 dbm 25 -43 to -6 17 dbm 26 -43 to -26 -3 dbm zicm357sp2-1c-ht fcc/ic 11 - 24 -43 to -2 20 dbm 25 -43 to -12 9 dbm 26 -43 to -38 -5 dbm note: ooo operating in power mode 3 at higher power settings may damage the pa em357 high temp mini modules this document is subject to change without notice document no: 0011-00-07-02-000 (issue a) free datasheet http:///
page 15 shipment the meshconnect modules have two delivery options (see ordering information on page 3): 1. trays (in bundles) of 330 units. each tray contains 66 units 2. tape and reel for easy assembly in a manufacturing environment. the reel diameter is 12.992 inches (330 mm) and contains 600 modules tape and reel dimensions measurements are in inches [mm] handling the meshconnect modules are designed and packaged to be processed in an automated assembly line. warning the meshconnect modules contain highly sensitive electronic circuitry. handling without proper esd protection may destroy or damage the module permanently. warning the meshconnect modules are moisture-sensitive devices. appropriate handling instructions and precautions are summarized in j-std-033. read carefully to prevent permanent damage due to moisture intake. moisture sensitivity level (msl) msl 3, per j-std-033 storage storage /shelf life in sealed bags is 12 months at < 40c and < 90% relative humidity. quality cel modules offer the highest quality at competitive prices. our modules are manufactured in compliance with the ipc-a-610 specifcation, class ii. our modules go through jesd22 qualifcation processes which include high temperature operating life tests, mechanical shock, temperature cycling, humidity and refow testing. cel conducts rf and dc factory testing on 100% of all production parts. cel builds the quality into our products, giving our customers confdence when integrating our products into their systems. shipment, handling and storage 0.0790.004 [2.000.10] 0.0710.004 [1.750.10] 0.7950.006 [20.200.15] 1.732 0.011 [44.000.30] 0.0140.002 [0.350.05] 0.9570.004 [24.300.10] 0.1690.004 [4.300.10] 0.9450.004 [24.000.10] 0.6690.004 [17.000.10] section a-a a a 0.157 [4.00] pitch section b-b b b em357 high temp mini modules this document is subject to change without notice document no: 0011-00-07-02-000 (issue a) free datasheet http:///
page 16 references reference documents download 120-035x-000 - silicon labs /ember em35x soc datasheet link 0011-02-17-00-000 - cel em35x ember mini module companion kit technical user guide link 0011-00-16-11-000 - cel zicm357sp2-1c external antenna implementation link revision history previous versions changes to current version page(s) 0011-00-07-02-000 (issue a) october 9, 2013 initial preliminary datasheet n/a em357 high temp mini modules this document is subject to change without notice document no: 0011-00-07-02-000 (issue a) free datasheet http:///
page 17 the information in this document is current as of the published date. the information is subject to change without notice. for actual design-in, refer to the latest publications of cel data sheets or data books, etc., for the most up-to-date specifcations of cel products. not all products and/or types are available in every country. please check with an cel sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of cel. cel assumes no responsibility for any errors that may appear in this document. cel does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of cel products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of cel or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customers equipment shall be done under the full responsibility of the customer. cel assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while cel endeavors to enhance the quality, reliability and safety of cel products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in cel products, customers must incorporate suffcient safety measures in their design, such as redundancy, fre- containment and anti-failure features. disclaimer for more information for more information about cel meshconnect products and solutions, visit our website at: www.cel.com/meshconnect . technical assistance for technical assistance, visit www.cel.com/meshconnecthelp . em357 high temp mini modules this document is subject to change without notice document no: 0011-00-07-02-000 (issue a) free datasheet http:///

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